IBM and Micron Technology announced that Micron will produce a new memory device using the first CMOS manufacturing technology to employ through-silicon vias (TSVs). This will result in a 15x faster memory, in a 90% smaller package, with 70% less energy used to transfer data.
More information at ibm.com.
A bug fix update of the IBM Advance Toolchain for PowerLinux 5.0 is released.
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